Innovative 3D-Printed Package
Piezoskin is proud to show you the new prototypes with 3D-printed optimized packages and electric pads, developed following the recent technological innovations at IIT, in collaboration with Nano Dimension Ltd.
The metal contact is one of the most crucial parts in ohmic-contact microelectromechanical (MEMS) as it determines the device performance and reliability, particularly for soft and flexible devices where the electrical connects are typically difficult to produce due to technical constraints.
To overcome this constraint in traditional approaches and enable Piezoskin to push boundaries, the DragonFly LDM™ additive manufacturing system from Nano Dimension was used to embed piezoelectric transducers into a compact, lightweight and robust package. The manufactured package has the electrical pads directly printed on the metal layers of the devices, on which is welded an RF connector.
Nano Dimension machines serve cross-industry needs by depositing proprietary consumable conductive and dielectric materials simultaneously, while concurrently integrating in-situ capacitors, antennas, coils, transformers and electromechanical components, to function at unprecedented performance. In particular, DragonFly system and materials are used to develop 3D printed sealed packaging with electrical pads for Micro-ElectroMechanical Systems (MEMS) developed for our purposes.